1、Gold plating (GEP) process
Gold layer thickness: 1μ"-150μ" (industry-leading adjustable range, supporting ultra-thick gold layer requirements)
Nickel layer thickness: 60μ"-400μ" (enhancing wear resistance and corrosion resistance)
Applicable scenarios: Gold fingers, high-frequency connectors and other high-reliability scenarios
Chemical Gold plating (ENIG) process
Gold layer thickness: 1μ"-10μ" (precisely controlled ±0.1μ" tolerance)
Nickel layer thickness: 60μ"-400μ" (to meet different welding strength requirements)
Advantages: Pad flatness < 0.2μm, perfectly suitable for BGA packaging and micro-pitch components
Chemical nickel palladium gold (ENEPIG) process
Gold layer thickness: 1μ"-150μ" (industry-leading adjustable range, supporting ultra-thick gold layer requirements)
Palladium thickness: 1μ"-15μ" (industry-leading adjustable range, supporting the demand for ultra-thick gold layers)
Nickel layer thickness: 60μ"-400μ" (enhancing wear resistance and corrosion resistance)
Applicable scenarios: carrier substrates, optical module boards, high-definition camera boards, high-power lighting substrates and other high-reliability scenarios;