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BOJINGTAI

Quality Assurance

​​​​​​​​​​​​​Quality always comes first- Every PCB and electronic assembly is produced under the control of our ISO9001 quality management system. All electronic manufacturing is in accordance with IPC acceptability standards. Baoyinlong(BYL) have a fully equipped laboratory facility to check process chemistry parameters, make reliability testing, performance testing, plated hole integrity with latest micro-sectioning and inspection equipment.


uDielectric Withstanding Voltage

To evaluate the dielectric breakdown ability of PCB


Withstand Current Test

Test line through high current load capacity


Wet and Heat Insulation Resistance Test

Test the product insulation performance

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Inductance Test

To measure the inductance of PCB per customer's requirement


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Impedance Test

To measure the impedance of PCB per customer's requirement

If you need printed circuit boards manufactured or assembled, you may contact us.  BYL Circuits high quality, low price, on-time delivery, excellent service will make you satisfied and more competitive in the market.

Ionic Contamination Test

To measure the ionic contamination of PCB which is before lamination, S/M and final product.


IST

To evaluate the reliability of copper plating and internal connection.


Thermal Shock Cycle Test

To evaluate the reliability of hole wall copper.


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Thermal Stress

To evaluate the capability of withstanding thermal shock.

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Steady State Tem. &Hum. Test

To simulate the extremely using condition of PCB.


Reflow Simulation

To simulate the process of solder, which can evaluate the maximal resistibility of solder process.


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Resistance to Solvents

To evaluate the capability of withstanding acidity or alkalescency.

Reflow Simulation Peel Strength Test

To test the bonding force between circuit and base material.


Pad Pulled Out Test

To measure the bond strength between pad and base material.


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Hole Plating Pulled Out Test

To measure the bond strength between hole plating and the hole barrel.

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Plating Adhesion Test

To measure the adhesion between base copper and plating copper