Quality Assurance
Quality always comes first- Every PCB and electronic assembly is produced under the control of our ISO9001 quality management system. All electronic manufacturing is in accordance with IPC acceptability standards. Baoyinlong(BYL) have a fully equipped laboratory facility to check process chemistry parameters, make reliability testing, performance testing, plated hole integrity with latest micro-sectioning and inspection equipment.
To evaluate the dielectric breakdown ability of PCB
Withstand Current Test
Test line through high current load capacity
Wet and Heat Insulation Resistance Test
Test the product insulation performance
Inductance Test
To measure the inductance of PCB per customer's requirement
Impedance Test
To measure the impedance of PCB per customer's requirement
Ionic Contamination Test
To measure the ionic contamination of PCB which is before lamination, S/M and final product.
IST
To evaluate the reliability of copper plating and internal connection.
Thermal Shock Cycle Test
To evaluate the reliability of hole wall copper.
Thermal Stress
To evaluate the capability of withstanding thermal shock.
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Steady State Tem. &Hum. Test
To simulate the extremely using condition of PCB.
Reflow Simulation
To simulate the process of solder, which can evaluate the maximal resistibility of solder process.
Resistance to Solvents
To evaluate the capability of withstanding acidity or alkalescency.
Reflow Simulation Peel Strength Test
To test the bonding force between circuit and base material.
Pad Pulled Out Test
To measure the bond strength between pad and base material.
Hole Plating Pulled Out Test
To measure the bond strength between hole plating and the hole barrel.
Plating Adhesion Test
To measure the adhesion between base copper and plating copper