Take the science and technology as the motive force

strives for the survival by the quality

PCB Technologies

• Double Sided Conventional (NonPTH)
• Plated Through Hole (2 Layers)
• Multi-Layers up to 48 Layers
• IMS (Metal Backed Substrates)
• Rogers, Taconic, Arlon & Nelco Laminates.

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Laminate Types

• ​FR4, High-Tg, Halogen-Free, BT Epoxy, PTFE, Polyimide, CEM1, CEM3, FR2, IMS, Rogers,etc
• Material thickness available from 0.1mm up to 10.0mm.

• ​Finished copper weights up to 420µ (12oz)Maximum 

PCB Manufacturing Panel Sizes

• PTH & Multi-Layer – 610mm x 1200mm (24"x 48”)
• Non PTH – 610mm x 1500mm (24” x 60”)
• Rogers Materials 305mm x 457mm (12" x 18")

Surface finish Technologies

• Leaded Hot Air Solder Levelling – HASL Non RoHS
• Lead Free Hot Air Solder Levelling – HASL RoHS compliant 
• Immersion Nickel Gold – RoHS compliant
• Electrolytic Hard Gold – RoHS compliant
• Immersion Silver – RoHS compliant
• Immersion Tin -RoHS compliantManufacturing Specifications and Tolerances
  • Min. track width/Space – 3/3mil for HOZ (inner layer); 4/4mil for HOZ(outer layer)
  • Min. hole Ø – 0.2mm (Mechanical Drilled); 3mil(0.075mm) of laser drill
  • Min. annular ring – 0.1mm (above drilled hole size)
  • Routed profile +/- 0.13mm
  • Finished hole Ø tolerance (Plated) +/- 0.05mm

HeHavy Copper Technologies

• Min. track width/Space – 6/6mil for 3oz; 7/7mil for 4oz; 8/8mil for 5oz; 9/9mil for 6oz; 20/20mil for 12oz; 

HDI Technologies

• N+C+N – N=3
• Min. track width/space – 3/3mil(inner); 3/3mil(outer layer)

Regid-Flex Technologies

• Min. track width/space – 2.5/2.5mil(inner); 3/3mil(outer layer)
• Air gap Flex layers – 12
• Max. layers of Asymmetric – 16 
• Registration of Asymmetric– 5 mil
• Materials – PI/ Halogen-Free/ LCP/Tk

Multi-layer Technologies

• Min. track width/Space – 3/3.5mil for HOZ (outer layer)
• Min. hole Ø – 0.2mm (Mechanical Drilled); 
• Registration– 4.5mil
• Aspect Ratio–15:1